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What is a multilayer circuit board,what are the advantages of multilayer PCB circuit boards

Time:2021-05-14 16:52

Multilayer circuit board as the name suggests is more than two layers of circuit boards to be called multilayer, before giving an analysis of what is a double-sided circuit board, then multilayer board is also more than two layers, such as four layers, six layers, eight layers, etc.. Of course, some designs are three or five layers of lines, also called multilayer PCB circuit boards. Greater than two-layer board conductive alignment diagram, layers and layers of insulating substrate separating, each layer of the line printed, and then by pressing together, each layer of the line overlap together. After that, the holes are drilled, and the conductivity between each layer of the line is achieved by passing the holes. The advantage of multilayer PCB circuit boards is that the lines can be distributed in multiple layers inside the wiring, so you can design more sophisticated products. Or smaller products can be realized by multilayer boards. Such as: cell phone circuit boards, micro projectors, audio recorders and other products of smaller size. In addition, multilayer can increase the flexibility of the design, you can better control the differential impedance and single-ended impedance, as well as some signal frequency better output.
       Multilayer circuit board is the inevitable product of the development of electronic technology to high speed, multi-function, high capacity, small volume direction. With the continuous development of electronics technology, especially large-scale and ultra-large-scale integrated circuits are widely used in depth, multilayer printed circuit is rapidly to high density, high precision, high level of digital direction to mention the emergence of micro fine lines, small aperture penetration, blind hole buried hole high board thickness aperture ratio and other technologies to meet the needs of the market. As the computer and aerospace industry needs for high-speed circuits. Requirements to further improve the packaging density, coupled with the reduction in the size of the separation components and the rapid development of microelectronics, electronic equipment is to reduce the volume, the direction of mass reduction; single, double-sided printed board due to the limitations of the available space, it is impossible to achieve a further increase in assembly density. Therefore, it is necessary to consider the use of more layers than the double-sided printed circuit board. This creates the conditions for the emergence of multilayer circuit boards.

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